this post was submitted on 15 Feb 2024
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And to add: currently TSMC nodes have a reticle limit of 858mm². I.e. that's the largest chips you can make on their wafers. Then in the real world you do it slightly below that.
Future nodes are reducing this to the 350-450mm² range.
High end GPUs/HPC cards basically have to go to multi-die, even in the fantasy world of 100% perfect yields.