this post was submitted on 12 Aug 2026
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It's because of diamond's high heat conductivity. The AI chips run too hot for traditional copper heat sinks to keep them cool.

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[–] someguy3@lemmy.world 16 points 3 days ago* (last edited 3 days ago) (5 children)

Following the links around

He noted that current cooling solutions do not replace copper entirely with diamond but mainly employ a "diamond + copper" combination, where diamond is responsible for frantically absorbing heat at the most critical localized hot spots, while copper continues to shoulder the burden of the main structure and signal transmission.

GPUs will fully adopt a solution combining diamond-copper composite thermal management and 45 C direct-to-chip liquid cooling.

Diamond Cooling: synthetic diamond material added as an extra layer in the thermal stack, intended to spread heat away from hotspots faster than conventional copper solutions,

Sounds like a diamond layer between the cpu and copper heatsink?

[–] nullify3112@lemmy.world 6 points 2 days ago

Diamond substrate when? If they could make chips out of diamond instead of silicon that would revolutionize how the heat dissipation works and how hard we can push the chips.

[–] Bluegrass_Addict@lemmy.ca 7 points 3 days ago (1 children)

sounds like a waste of more resources for a useless pile of garbage

[–] antonamo@feddit.org 1 points 2 days ago (1 children)

Maybe currently, but imagine what could arise from the foundational research here. First actual benifit of AI might be more efficient computing. Compare it to the fibre from dot com or GPS and IMU from war research.

[–] Not_mikey@lemmy.dbzer0.com 5 points 3 days ago

Yeah, according to this article it says they use a diamond wafer on the CPU, but there is current research into getting the diamond as close to, or even directly on the silicon.

[–] RelativeArea1@sh.itjust.works 1 points 2 days ago* (last edited 2 days ago)

~~diamond copper? how? diamond burns into co² at around 800-900c and copper melting point is around 1000c, is this some corpo bait speak again for investors?~~

edit : oh, they meant something like thermal paste or similar

[–] solrize@lemmy.ml 1 points 3 days ago

Sounds like a diamond layer between the cpu and copper heatsink?

Yeah I guess they use the diamond layer instead of thermal paste.